3D Microelectronic Packaging

Deepak Goyal

ISBN 10: 3319830864 / ISBN 13: 9783319830865

Published by Springer International Publishing, Springer International Publishing Jul 2018, 2018

About this Item

This item is printed on demand - Print on Demand Titel. Neuware -This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 476 pp. Englisch.

Seller Inventory # 9783319830865

Bibliographic Details

• Title: 3D Microelectronic Packaging
• Publisher: Springer International Publishing, Springer International Publishing Jul 2018
• Publication Date: 2018
• Language: English
• ISBN 10: 3319830864
• ISBN 13: 9783319830865
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 235W x 155H x 26D millimeters 235 millimeters width by 155 millimeters height by 26 millimeters depth
• Weight: 715 grams

About this title

Synopsis

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 

From the Back Cover

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights intokey areas for future research and development.

• Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages
• Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis
Discusses 3D electronic package architecture and assembly process design
• Features contributions from both academic and industry authors, for a complete view of this important technology