3D Microelectronic Packaging : From Fundamentals to Applications

Language: English

Published by Springer, 2018

3319830864 / 9783319830865

Series: Book 61 of 72 - Springer Series in Advanced Microelectronics

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Druck auf Anfrage Neuware - Printed after ordering - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Seller Inventory # 9783319830865

Title
3D Microelectronic Packaging : From Fundamentals to Applications
Author
Yan Li
Publisher
Springer
Publication year
2018
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3319830864
ISBN 13
9783319830865
Item weight
715 grams
Dimensions
235x155x26 mm
Series
Book 61 of 72: Springer Series in Advanced Microelectronics

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

Item30 to 40 business days7 to 14 business days
First itemUS$ 73.66US$ 85.24
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