3rd International Conference on the Application of Superabsorbent Polymers (SAP) and Other New Admixtures Towards Smart Concrete

William P. Boshoff (u. a.)

ISBN 10: 3030333418 / ISBN 13: 9783030333416

Published by Springer, 2019

About this Item

3rd International Conference on the Application of Superabsorbent Polymers (SAP) and Other New Admixtures Towards Smart Concrete | William P. Boshoff (u. a.) | Buch | xxiii | Englisch | 2019 | Springer | EAN 9783030333416 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.

Seller Inventory # 117437901

Bibliographic Details

• Title: 3rd International Conference on the Application of Superabsorbent Polymers (SAP) and Other New Admixtures Towards Smart Concrete
• Publisher: Springer
• Publication Date: 2019
• Language: English
• ISBN 10: 3030333418
• ISBN 13: 9783030333416
• Binding: Buch
• Condition: Neu
• Dimensions: 241W x 160H x 21D millimeters 241 millimeters width by 160 millimeters height by 21 millimeters depth
• Weight: 594 grams
• Seller catalogs:
  • Bücher

About this title

Synopsis

The book gathers the peer-reviewed contributions presented at the 3rd International Conference on Application of Superabsorbent Polymers (SAP) and Other New Admixtures towards Smart Concrete, held in Skukuza, South Africa, on November 25-27, 2019. It features papers focusing on the behavior of SAP in concrete (in particular the absorption behavior) as well as the effect of SAP on fresh and hardened concrete properties. It also covers topics such as other modern admixtures, in particular rheology-modifying admixtures, including the recently emerging field of bio- or waste-derived admixtures. The conference builds on the experience and summarizes the activities of the RILEM Technical Committee 260-RSC "Recommendations for Use of Superabsorbent Polymers in Concrete Construction" and addresses other prominent research activities in the field of concrete admixtures.