79th Conference on Glass Problems (Hardcover)

S.K. Sundaram

ISBN 10: 1119631556 / ISBN 13: 9781119631552

Published by John Wiley & Sons Inc, New York, 2019

About this Item

Hardcover. This proceedings contains a collection of 21 papers presented at the 79th Conference on Glass Problems held November 4-8, 2018 in Columbus, Ohio. Papers touch on topics critical to glass manufacturers including melting and combustion; refractories; forming; and environmental issues. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

Seller Inventory # 9781119631552

Bibliographic Details

• Title: 79th Conference on Glass Problems (Hardcover)
• Publisher: John Wiley & Sons Inc, New York
• Publication Date: 2019
• Language: English
• ISBN 10: 1119631556
• ISBN 13: 9781119631552
• Binding: Hardcover
• Condition: new

About this title

Synopsis

This proceedings contains a collection of 21 papers presented at the 79th Conference on Glass Problems held November 4-8, 2018 in Columbus, Ohio. Papers touch on topics critical to glass manufacturers including melting and combustion; refractories; forming; and environmental issues.

About the Author

S. K. SUNDARAM, PhD, is an Inamori Professor of Materials Science and Engineering at Alfred University. Before joining Alfred University, Dr. Sundaram was a chief materials scientist at the Pacific Northwest National Laboratory (PNNL). He joined the PNNL in 1994 as a post-doctoral fellow and became a senior research scientist in 1996. He was then promoted to chief materials scientist in January 2002. Dr. Sundaram is internationally recognized for interdisciplinary research. He has made over 100 technical presentations, edited/contributed to twelve books, published over eighty peer-reviewed publications and technical reports, mentored/supported over forty-five students, and organized/co-organized several national and international symposia on advanced topics in materials science. He is also a co-inventor in three issued patents and two provisional patent applications.