Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection) - Hardcover
Synopsis
The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested, and manufactured. This new, still evolving technology for packaging printed circuit boards (PCBs) is commanding intense interest and excitement. Now one of its pioneers has written the first book that not only describes MCM technology, but also shows designers how to use it in practice. This groundbreaking, hands-on guide covers such practical issues as electronics testing, rework procedures, and failure modes and mechanisms.
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Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_377209750