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Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection) - Hardcover
Synopsis
The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested, and manufactured. This new, still evolving technology for packaging printed circuit boards (PCBs) is commanding intense interest and excitement. Now one of its pioneers has written the first book that not only describes MCM technology, but also shows designers how to use it in practice. This groundbreaking, hands-on guide covers such practical issues as electronics testing, rework procedures, and failure modes and mechanisms.
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Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
Seller: -OnTimeBooks-, Phoenix, AZ, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships USPS Media Mail. Seller Inventory # OTV.0070377154.VG