Area Array Packaging Processes: for BGA, Flip Chip, and CSP

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9780071428293: Area Array Packaging Processes: for BGA, Flip Chip, and CSP

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

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From the Back Cover:

This expert monograph on area array packaging processes delivers concise coverage of leading-edge assembly and manufacturing methods. Featuring the manufacturing processes and equipment of today’s state-of-the-art electronic packaging, clearly explained by a team of world-class professionals and researchers, Area Array Packaging Processes and Equipment details cost-effective manufacturing methods you won’t find elsewhere. Look inside for:

* Expert information on key processes
* Cutting-edge, in-depth coverage of processes for each area array technology
* Data on flip chip materials, processes, assembly, and underfilling
* BGA and CSP rework solutions
* Detailed descriptions of die-attach methods, materials, and rework
* Coverage of liquid encapsulation equipment and processes and molding for area array packaging
* Discussions of cost, quality, reliability, cycling, tooling, failure mechanisms, productivity, and more

About the Author:

Ken Gilleo, Ph.D., is a well-known author/editor/ columnist in the field of microelectronics packaging and General Technologist for Cookson Electronics, a world leader in process control expertise, solutions, service, and resources for the PCB assembly and semiconductor packaging industries. His Area Array Packaging Handbook: Manufacturing and Assembly, also published by McGraw-Hill, is the premier professional guide in the field. Dr. Gilleo also has edited the Handbook of Flexible Circuits and Polymer Thick Film, and has written over 400 articles on packaging, circuitry, MEMS, and materials. He holds 35 U.S. patents, currently serves on the Board of Directors of the Surface Mount Technology Association, and is active in IEEE, IMAPS, and other professional organizations. He lives in Cranston, Rhode Island.

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