Items related to 3D IC Integration and Packaging

3D IC Integration and Packaging - Hardcover

Lau, John H.

 
9780071848060: 3D IC Integration and Packaging
Hardcover
ISBN 10: 0071848061 ISBN 13: 9780071848060
Publisher: McGraw Hill, 2015

Synopsis

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A comprehensive guide to 3D IC integration and packaging technology

3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.


3D IC Integration and Packaging covers:


• 3D integration for semiconductor IC packaging
• Through-silicon vias modeling and testing
• Stress sensors for thin-wafer handling and strength measurement
• Package substrate technologies
• Microbump fabrication, assembly, and reliability
• 3D Si integration
• 2.5D/3D IC integration
• 3D IC integration with passive interposer
• Thermal management of 2.5D/3D IC integration
• Embedded 3D hybrid integration
• 3D LED and IC integration
• 3D MEMS and IC integration
• 3D CMOS image sensors and IC integration
• PoP, chip-to-chip interconnects, and embedded fan-out WLP

"synopsis" may belong to another edition of this title.

About the Author

John Lau, Ph.D., is both an ASME and an IEEE fellow. He has written 17engineering books, published more than 425 peer-reviewed papers, and given 290lectures, workshops, and keynotes worldwide.

"About this title" may belong to another edition of this title.

Publisher
McGraw Hill
Publication date
2015
Language
English
ISBN 10 
0071848061
ISBN 13 
9780071848060
Binding
Hardcover
Edition number
1
Number of pages
480