BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage (Woodhead Publishing Series in Electronic and Optical Materials) - Softcover

Hu, Chenming; Agarwal, Harshit; Gupta, Chetan; Chauhan, Yogesh Singh

Softcover

ISBN 10: 0323856772 ISBN 13: 9780323856775

Publisher: Woodhead Publishing, 2023

Synopsis

BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage provides in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures, addressing geometrical scaling, temperatures, and more. There is also a dedicated chapter on extensive quality testing procedures and experimental results. This book discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia.

Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed.

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About this title

About the Authors

Chenming Hu is TSMC Distinguished Chair Professor Emeritus at the University of California Berkeley, United States. He was the Chief Technology Officer of TSMC. He received the US Presidential Medal of Technology and Innovation from Pres. Barack Obama for developing the first 3D thin-body transistor FinFET, MOSFET reliability models and leading the development of BSIM industry standard transistor model that is used in designing most of the integrated circuits in the world. He is a member of the US Academy of Engineering, the Chinese Academy of Science, and Academia Sinica. He received the highest honor of IEEE, the IEEE Medal of Honor, and its Andrew Grove Award, Solid Circuits Award, and the Nishizawa Medal. He also received the Taiwan Presidential Science Prize and UC Berkeley’s highest honor for teaching – the Berkeley Distinguished Teaching Award.

Harshit Agarwal received the PhD degree from Indian Institute of Technology Kanpur, India in 2017. He is currently working as center manager and post-doc fellow at Berkeley Device Modeling Centre, BSIM group, University of California Berkeley, Berkeley, USA. He has been involved in the development of multi-gate and bulk MOSFET models. He is also involved in the modeling and characterization of advanced steep sub-threshold slope devices like negative capacitance FETs, tunnel FET etc. He has authored several papers in the field of semiconductor device modeling, simulation and characterization.

He is a Co-Developer of BSIM-BULK (formerly BSIM6) industry standard models for BULK-MOSFET. He has published 8 journal papers and 10 conference papers all on the development of the BSIM-BULK model. His current research interests include semiconductor device physics, modeling, and characterization.

Yogesh Singh Chauhan is a Chair Professor in the Department of Electrical Engineering at the Indian Institute of Technology Kanpur, India. He is the developer of several industry standard models: ASM-HEMT, BSIM-BULK (formerly BSIM6), BSIM-CMG, BSIM-IMG, BSIM4 and BSIM-SOI models. His research group is involved in developing compact models for GaN transistors, FinFET, nanosheet/gate-all-around FETs, FDSOI transistors, negative capacitance FETs and 2D FETs. His research interests are RF characterization, modeling, and simulation of semiconductor devices.

From the Back Cover

BSIM-BULK compact model is the most recent industry standard model of the MOS transistor. It is used by the semiconductor industry as well as academicians and researchers for designing analog, RF, and logic circuits. While the model is commercially integrated into all major integrated circuit simulators, literature on model derivation, physical and numerical approximations are limited.

In BSIM-BULK, the developers provide in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures addressing geometrical scaling, temperatures, etc. There is a dedicated chapter on extensive quality testing procedures and experimental results.

Those working in the semiconductor industry often run into variety of problems like model non-convergence or non-physical simulation results. This is largely due to limited understanding of the internal operations of the model as the literature in the form of technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed. BSIM-BULK discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia.

Edition details

• Publisher: Woodhead Publishing
• Publication date: 2023
• Language: English
• ISBN 10: 0323856772
• ISBN 13: 9780323856775
• Binding: Paperback
• Edition number: 1
• Number of pages: 270