Building Systems: Design Technology and Society - Softcover

Softcover

ISBN 10: 0415617944 ISBN 13: 9780415617949

Publisher: Routledge, 2012

Synopsis

We can no longer view building components as artifacts (a brick or a boiler) or as autonomous systems (air conditioning or prefabrication). Rather these components and systems are part of much larger systems of which architects are one agent. This book will help architects more broadly envision these networks including :

• canonical texts as well as contemporary thinking from well known theorists and practitioners, each contribution frames a specific range of technology in relation to society such as building process, products, economies and ecologies
• clearly structured, the book is divided into three parts; each accompanied by a comprehensive introduction by the editors
• an annotated bibliography provides a glossary of further reading
• illustrated throughout with over 100 illustrations.

The book calls for integration, a convergence and confluence of social and technical factors, discovering the capability and culpability of such; for architects to finally realize that the term building systems is best grasped as a verb, not a set of nouns.

This reader presents students, faculty and practicing architects with an expanded view of technology in architecture that transcends naive determinisms and technocratic applications; forming a more pithy intellectual context for the complex and contingent roles of technology in twenty-first century architecture.

About this title

About the Author:

Kiel Moe is Assistant Professor of Architectural Technologies at the Harvard Graduate School of Design.

Ryan E. Smith is Associate Professor and Director of the Integrated Technology in Architecture Center at the University of Utah, College of Architecture and Planning.

About this edition

• Publisher: Routledge
• Publication date: 2012
• ISBN 10: 0415617944
• ISBN 13: 9780415617949
• Binding: Paperback
• Edition number: 1
• Number of pages: 272
• Editor: Moe Kiel, Smith Ryan E.