Items related to Plastic Packaging of Microelectronic Devices
Synopsis
Packaging has often been a secondary consideration to silicon device fabrication and has received less attention than its contribution to overall device performance, reliability, and cost should warrant. The situation is changing as packaging limitations begin to impose restrictions on device and system designs. Included here are the basics of polymer science and engineering for microelectronics packaging, mathematical treatments and simulations of processes, materials guides, methods of product reliability and quality assurance, and descriptions of equipment, tooling, and facilities options. Annotation copyright Book News, Inc. Portland, Or.
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Plastic Packaging of Microelectronic Devices
Published by
Thomson Learning, New York, 1990
ISBN 10: 0442234945
ISBN 13: 9780442234942
Used
Hardcover
First Edition
Seller: Carpe Diem Fine Books, ABAA, Monterey, CA, U.S.A.
Seller rating 4 out of 5 stars
Hardcover. 1st. 8vo. 377pp. Bibliography. Index. Illustrations. Review copy. Fine in fine dustjacket. Seller Inventory # 11077
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PLASTIC PACKAGING OF MICROELECTRONIC DEVICES
Published by
NEW YORK VAN NOSTRAND, 1990
ISBN 10: 0442234945
ISBN 13: 9780442234942
Used
Hardcover
First Edition
Seller: Hawkridge Books, Bakewell, United Kingdom
Seller rating 4 out of 5 stars
1ST EDITION. NEAR FINE IN DUSTWRAP. 377 PAGES. ILLUSTRATED WITH DIAGRAMS. Seller Inventory # 27459
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