This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design―creating the optimal combination between theory and practical applications.
Following an introduction to the importance of signal integrity, chapter coverage includes:
Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.
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HOWARD L. HECK is a Principal Engineer at Intel Corporation, where he leads development of the signaling specifications and solutions for USB 3.0. He also teaches high-speed digital interconnect design at the Oregon Graduate Institute, is a Senior Member of the IEEE, and holds five patents in the area of high-performance packaging and interconnects, with five more pending.
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Book Description Condition: New. Offers a synergistic compromise between theoretical and practical books Theory will be presented in the context of real life design examples Leverages theory and techniques from non-related fields, such as applied physics, communications and microwave engineering Covers virtually all of the most modern concepts in signal integrity. Num Pages: 680 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 196 x 278 x 42. Weight in Grams: 1142. . 2009. 1st Edition. Hardcover. . . . . Seller Inventory # V9780470192351
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