The awaited revision of Semiconductor Devices: Physics and Technology offers more than 50% new or revised material that reflects a multitude of important discoveries and advances in device physics and integrated circuit processing.
Offering a basic introduction to physical principles of modern semiconductor devices and their advanced fabrication technology, the third edition presents students with theoretical and practical aspects of every step in device characterizations and fabrication, with an emphasis on integrated circuits.
Divided into three parts, this text covers the basic properties of semiconductor materials, emphasizing silicon and gallium arsenide; the physics and characteristics of semiconductor devices bipolar, unipolar special microwave and photonic devices; and the latest processing technologies, from crystal growth to lithographic pattern transfer.
"synopsis" may belong to another edition of this title.
S. M. Sze, PhD, is UMC Chair Professor in the Electronics Engineering Department at the National Chiao Tung University. His previous books include Semiconductor Devices; Physics of Semiconductor Devices, Second Edition; High-Speed Semiconductor Devices; and Semiconductor Sensors, all available from Wiley.
Ming-Kwei Lee is the author of Semiconductor Devices: Physics and Technology, 3rd Edition, published by Wiley.
This Third Edition of Semiconductor Devices offers revised material that reflects many important discoveries and advances in device physics and integrated circuit processing that have taken place over the last decade.
Offering a basic introduction to physical principles of modern semiconductor devices and their advanced fabrication technology, the Third Edition presents students with theoretical and practical aspects of every step in device characterizations and fabrication, with an emphasis on integrated circuits.
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ALSO NEW TO THE THIRD EDITION:
DESCRIPTION OF THE COVER ILLUSTRATION
The illustration shows a bird's-eye view of a 3-dimensional floating-gate non-volatile semiconductor memory (NVSM). NVSM is the foundation technology of information storage for all modern electronic systems (e.g., the digital cellular phone, digital camera, personal digital assistant, and global positioning system). NVSM has ushered in the "Digital Age", and pushed forward the electronics industry to become the largest industry in the world.
The device shown has a surrounding floating gate (the central circular section) and two control gates (the upper and lower rectangular sections). The device is a promising candidate for 1 tera-bit (1012 bits) and beyond NVSM chips. Courtesy of the Institute of Electrical and Electronics Engineers (IEEE) and S. Whang et al of Hynix Semiconductor Inc. (IEEE IEDM Technical Digest, p. 668, 2010).
For a discussion of NVSM and other semiconductor memories, see Chapter 6.
This Third Edition of Semiconductor Devices offers revised material that reflects many important discoveries and advances in device physics and integrated circuit processing that have taken place over the last decade.
Offering a basic introduction to physical principles of modern semiconductor devices and their advanced fabrication technology, the Third Edition presents students with theoretical and practical aspects of every step in device characterizations and fabrication, with an emphasis on integrated circuits.
HALLMARK FEATURES:
ALSO NEW TO THE THIRD EDITION:
DESCRIPTION OF THE COVER ILLUSTRATION
The illustration shows a bird's-eye view of a 3-dimensional floating-gate non-volatile semiconductor memory (NVSM). NVSM is the foundation technology of information storage for all modern electronic systems (e.g., the digital cellular phone, digital camera, personal digital assistant, and global positioning system). NVSM has ushered in the "Digital Age", and pushed forward the electronics industry to become the largest industry in the world.
The device shown has a surrounding floating gate (the central circular section) and two control gates (the upper and lower rectangular sections). The device is a promising candidate for 1 tera-bit (1012 bits) and beyond NVSM chips. Courtesy of the Institute of Electrical and Electronics Engineers (IEEE) and S. Whang et al of Hynix Semiconductor Inc. (IEEE IEDM Technical Digest, p. 668, 2010).
For a discussion of NVSM and other semiconductor memories, see Chapter 6.
"About this title" may belong to another edition of this title.
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