Signal Integrity Effects in Custom IC and ASIC Designs - Hardcover

Hardcover

ISBN 10: 0471150428 ISBN 13: 9780471150428

Publisher: Wiley-IEEE Press, 2001

Synopsis

"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity."
—Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc.

• Covers signal integrity effects in high performance Radio Frequency (RF) IC
• Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future

A Wiley-IEEE Press publication

About this title

From the Publisher

"In the era of System-on-Chip, when large portions of the overall system are integrated on one large chip, designers are facing increasingly challenging issues. For the first time, this book is taking a closer look at the signal integrity problems faced by both high-performance and cost-performance applications, digital and mixed-signal integrated circuits. System designers are given guidance in power distribution analysis, interconnect optimization, and mixed, digital-analog circuit integration challenges. Researchers and CAD engineers can get an in-depth view of the current and future requirements for full-chip CAD tools, on-chip transmission line designs, integrated passive components, and many other critical signal integrity issues. This book is bringing together a broad range of representative papers that will further the understanding both in the industrial and academic communities." (Alina Deutsch, Research Staff Member, T.J. Watson Research Center, International Business Machines)

"Electrical integrity (or environment noise) is becoming the principal obstacle in system-on-a-chip design. Digital circuits create a very noisy environment in which other digital and analog circuits must function. This environmental noise comes about because of coupling through the interconnect, power supply, and substrate. This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems-on-a-chip." (Kenneth L. Shepard, Professor, Columbia University)

"The explosion of wireless communications that offer greater mobility and broadband communications that provide super fast access to the Internet have placed new demands on IC designers. The key to developing successful Systems on Chip designs that offer Analog and Mixed Signal capabilities is the approach used to extract and analyze the affects of parasitics on signal integrity. This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." (Jake Buurma Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc.)

"As technology scales to .1 micron and below, second order effects due to physical phenomena that were not much visible before start playing a more and more significant role. So much so that well-established methodologies and tools are not providing the necessary level of confidence to the designer that her/his integrated circuit will perform as planned. The need for more accurate extraction and analysis is obvious when we observe horror stories about very hard to detect intermittent faults created by interactions among signals on different wires. There are two complementary approaches to the problem that come to mind as always when we go over the limit of previous methods - increase the accuracy of the analysis tools, and/or solve the problems by imposing constraints on the degrees of freedom left to the designer. This collection of papers covers both in details. It is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection." (Alberto Sangiovanni-Vincentelli,Professor, University of California Berkeley)

"Even as recently as 1990, most integrated circuit professionals dismissed growing concerns about interconnect-related problems as unnecessarily alarmist. But now that the 21st century has begun, design tool developers are desperate for strategies to deal with an onslaught of interconnect issues. Signal crosstalk is degrading performance, wire inductance is impeding power distribution, and substrate noise is interfering with sensitive analog circuits. The Editor has gathered together a collection of papers, both tutorial and advanced, that address a broad range of interconnect problems. And the reader will benefit seeing the interconnect problem from the design, extraction, analysis and synthesis points of view."(Jacob White, Professor, Massachusetts Institute of Technology)

From the Back Cover

Praise for Signal Integrity Effects in Custom IC and ASIC Designs

"For the first time, this book is taking a closer look at the signal integrity problems faced by both high-performance and cost-performance applications, digital and mixed-signal integrated circuits."
-Alina Deutsch, Research Staff Member
T.J. Watson Research Center, International Business Machines

"This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems-on-a-chip."
-Kenneth L. Shepard, Professor
Columbia University

"This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity."
-Jake Buurma, Senior Vice President
Worldwide Research & Development, Cadence Design Systems, Inc.

"This collection of papers . . . is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection."
-Alberto Sangiovanni-Vincentelli, Professor
University of California Berkeley

"The editor has gathered together a collection of papers, both tutorial and advanced, that address a broad range of interconnect problems."
-Jacob White, Professor
Massachusetts Institute of Technology

Signal Integrity Effects in Custom IC and ASIC Designs compiles recent expert research papers in state-of-the-art IC (Integrated Circuits) design. It offers a detailed focus on all the major topics in understanding and modeling real-world IC signal integrity issues for CAD and IC design engineers, as well as graduate engineering students.

Practical, in-depth discussion of interconnect effects, inductance effects, power grid and distribution noise, and substrate noise and coupling is included. This specialized coverage provides the knowledge necessary to overcome serious problems in new, more complicated IC designs, such as:
* Wired and wireless communications ICs
* Large custom analog mixed-signal ICs
* ASIC designs from 0.12 microns and above
* Integrated custom IC blocks in ASIC (Applications-Specific Integrated Circuit) designs

Edition details

• Publisher: Wiley-IEEE Press
• Publication date: 2001
• ISBN 10: 0471150428
• ISBN 13: 9780471150428
• Binding: Hardcover
• Language: English
• Edition number: 1
• Number of pages: 480
• Editor: Singh Raminderpal