In recent years, customer demands for higher speeds and smaller chips have resulted in the use of interconnections in multilevel and multilayer configurations. Various issues associated with very large scale integrated circuit (VLSIC) interconnections used for high-speed applications are emphasized. Written for those who want to gain a better understanding of the factors associated with modeling, analyzing and simulating high-density, high-speed interconnections, the chapters are designed so that they can be read independently.
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Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear. Seller Inventory # GWSVV.0471571229.G
Seller: Dorley House Books, Inc., Hagerstown, MD, U.S.A.
Hardcover. Condition: Very Good. Dust Jacket Condition: Near Fine. Diagrams; Formulae (illustrator). 1st. dj in mylar; 622 clean, unmarked pages; 1st printing. Seller Inventory # 036221