Items related to Heat Transfer
Emphasizing an interdisciplinary approach to thermal engineering which attempts to accurately reflect practice and problems in the field, this textbook integrates key industrial applications into three traditional content areas: conduction, convection and radiation.
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From the Publisher:
Relates introductory heat transfer concepts to other disciplines, namely thermodynamics and fluid mechanics. Reflects changes currently taking place in the research community as well as engineering education. Emphasizes that real applications tend to be interdisciplinary and require a solid foundation in all areas of the thermal sciences. Emphasizes design, or the synthesizing of two or more issues into an answer with practical meaning. Design questions are drawn from many diverse areas and each question is presented in a fundamental way. Makes a strong case regarding the use of simple and approximate analyses, focusing on order-of-magnitude calculations or ``scale analysis''. Applications are interdisciplinary.
From the Back Cover:
Laminar air flow through plate fins in the microchannel heat sink built into the back of an integrated circuit chip. This figure shows the pressure distribution; the corresponding temperature distribution is shown on the front cover, where the flow direction is upward. The Reynolds number based on the swept length of the plate fin is 150. The optimization of a related microchannel geometry is proposed in Project 6.4 in the text.
"About this title" may belong to another edition of this title.
- PublisherJohn Wiley and Sons Ltd
- Publication date1993
- ISBN 10 0471599522
- ISBN 13 9780471599524
- BindingPaperback
- Rating
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