Fundamentals of Electrochemical Deposition - Hardcover

Paunovic, Milan; Schlesinger, Mordechay

Hardcover

ISBN 10: 0471712213 ISBN 13: 9780471712213

Publisher: Wiley-Interscience, 2006

Synopsis

Excellent teaching and resource material . . . it is concise, coherently structured, and easy to read . . . highly recommended for students, engineers, and researchers in all related fields."
-Corrosion on the First Edition of Fundamentals of Electrochemical Deposition

From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition plays a crucial role in an array of key industries. Fundamentals of Electrochemical Deposition, Second Edition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge.

The most authoritative introduction to the field so far, the book presents detailed coverage of the full range of electrochemical deposition processes and technologies, including:
* Metal-solution interphase
* Charge transfer across an interphase
* Formation of an equilibrium electrode potential
* Nucleation and growth of thin films
* Kinetics and mechanisms of electrodeposition
* Electroless deposition
* In situ characterization of deposition processes
* Structure and properties of deposits
* Multilayered and composite thin films
* Interdiffusion in thin film
* Applications in the semiconductor industry and the field of medicine

This new edition updates the prior edition to address the new developments in the science and its applications, with new chapters on innovative applications of electrochemical deposition in semiconductor technology, magnetism and microelectronics, and medical instrumentation. Added coverage includes such topics as binding energy, nanoclusters, atomic force, and scanning tunneling microscopy.Example problems at the end of chapters and other features clarify and improve understanding of the material.

Written by an author team with extensive experience in both industry and academe, this reference and text provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology.

About this title

About the Author

MILAN PAUNOVIC, PhD, was, until recently, a research staff member in the Electrodeposition Technology Department at the IBM T. J. Watson Research Center. He began work on electrochemical metal deposition in 1961 at the University of Pennsylvania, Philadelphia, and subsequently worked on metal deposition at Reynolds Metals, Kollmorgen, and Intel. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and Modern Electroplating (both by Wiley), has edited four symposia proceedings volumes of The Electrochemical Society, published forty-one papers, and holds seven patents.

MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He is a former associate editor of both the Journal of The Electrochemical Society and Electrochemical and Solid State Letters. He is a fellow of the American Physical Society and The Electrochemical Society. He has also been named a General Motors Academic Research Fellow. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and of Modern Electroplating. He has published over 120 research papers and holds four patents.

Review

"...an excellent book for explaining electrochemical deposition to students, practicing engineers, or scientists..." (Journal of Metals Online, July 25, 2007)

"...a great book for anyone who wants to learn about the fundamentals of electrochemical deposition." (IEEE Electrical Insulation Magazine, July/August 2007)

"The book is a definitive treatment of the subject by two experts in the field..." (CHOICE, February 2007)

Edition details

• Publisher: Wiley-Interscience
• Publication date: 2006
• ISBN 10: 0471712213
• ISBN 13: 9780471712213
• Binding: Hardcover
• Language: English
• Edition number: 2
• Number of pages: 392