This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.
"synopsis" may belong to another edition of this title.
David Brandon,Technion, Israel Institute of Technology, Israel, is the author of Joining Processes: An Introduction, published by Wiley.
Wayne D. Kaplan, Technion, Israel Institute of Technology, Israel, is the author of Joining Processes: An Introduction, published by Wiley.
This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.
This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.
"About this title" may belong to another edition of this title.
Seller: Better World Books Ltd, Dunfermline, United Kingdom
Condition: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Seller Inventory # 3304846-20
Quantity: 1 available
Seller: Biblioteca di Babele, Tarquinia, VT, Italy
Condition: BUONO USATO. Da revisionare INGLESE Volume brossurato in cartoncino flessibile, dalla copertina illustrata, leggermente annerita. Buonissimo lo stato di conservazione, pagine perfettamente tenute, velate da tonalità avorio, come i tagli, ricche di figure, grafici e tabelle, nel testo. Numero pagine 363. Seller Inventory # NCE4849
Quantity: 1 available
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions. Seller Inventory # Z1-S-021-01489
Quantity: 1 available
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: New. Seller Inventory # 35221-n
Seller: Books Puddle, Woodside, NY, U.S.A.
Condition: New. pp. 378 1st Edition. Seller Inventory # 26458663
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000. Seller Inventory # FW-9780471964889
Quantity: 15 available
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.
paperback. Condition: New. In shrink wrap. Looks like an interesting title! Seller Inventory # Q-0471964883
Seller: Chiron Media, Wallingford, United Kingdom
PF. Condition: New. This item is printed on demand. Brand new book, sourced directly from publisher. Dispatch time is 6-7 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely. Seller Inventory # 6666-IUK-9780471964889
Quantity: 20 available
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: As New. Unread book in perfect condition. Seller Inventory # 35221
Seller: Brook Bookstore On Demand, Napoli, NA, Italy
Condition: new. Seller Inventory # 42782f088b2dbd39167914a533ea846e
Quantity: Over 20 available