PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION NOVEMBER 11-16, 2001 NEW YORK,NEW YORK Collection of 42 full-length, peer-reviewed technical papers from annual symposia sponsored by the ASME Heat Tranfer Division. Major areas of discussion Fundamentals of Heat Transfer in Electronics Cooling; Advanced Simulation Methods for Electronics Cooling; Current Trends/Challenges in the Thermal Management of Electronic Systems; Nanoscale Thermal Management of Electronic Devices; Heat Pipes and Multiphase Heat Transfer in Electronic Systems; Student Heat Transfer Research and Design; Innovation and Application of Heat Transfer Visualization Techniques.
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