Synopsis
Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solutions are being found.
Contents
- Introduction
- Interconnect issues
- Copper deposition
- Copper patterning
- Interlayer dielectrics
- Cu/ILD barriers
- Current practice
- Index
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Copper Interconnect Technology (SPIE Tutorial Texts in Optical Engineering Vol. TT46)
Published by
SPIE Publications (edition 1), 2001
ISBN 10: 0819438979
ISBN 13: 9780819438973
Used
Paperback
Seller: BooksRun, Philadelphia, PA, U.S.A.
Seller rating 5 out of 5 stars
Paperback. Condition: Fair. 1. The item might be beaten up but readable. May contain markings or highlighting, as well as stains, bent corners, or any other major defect, but the text is not obscured in any way. Seller Inventory # 0819438979-7-1-13