Ceramic Interconnect Technology Handbook

ISBN 13: 9780849335570

Ceramic Interconnect Technology Handbook

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9780849335570: Ceramic Interconnect Technology Handbook
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Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.

Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates.

Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

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University of Idaho, Moscow, USA University of Arkansas, Fayetteville, USA

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Book Description Taylor Francis Inc, United States, 2007. Hardback. Condition: New. Language: English . This book usually ship within 10-15 business days and we will endeavor to dispatch orders quicker than this where possible. Brand New Book. Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications. Seller Inventory # BTE9780849335570

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Book Description CRC Press, 2007. Hardback. Condition: NEW. 9780849335570 This listing is a new book, a title currently in-print which we order directly and immediately from the publisher. For all enquiries, please contact Herb Tandree Philosophy Books directly - customer service is our primary goal. Seller Inventory # HTANDREE0195208

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Book Description 2007. Hardcover. Condition: New. 1st. Hardcover. Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most.Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. 441 pages. 0.776. Seller Inventory # 9780849335570

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