Items related to Electronic Packaging Materials and Their Properties

9780849396250: Electronic Packaging Materials and Their Properties
Hardcover
ISBN 10: 0849396255 ISBN 13: 9780849396250
Publisher: CRC Press, 1998

Synopsis

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

  • interconnections
  • printed circuit boards
  • substrates
  • encapsulants
  • dielectrics
  • die attach materials
  • electrical contacts
  • thermal materials
  • solders
    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

    • "synopsis" may belong to another edition of this title.

    About the Author

    Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

    "About this title" may belong to another edition of this title.

    Publisher
    CRC Press
    Publication date
    1998
    Language
    English
    ISBN 10 
    0849396255
    ISBN 13 
    9780849396250
    Binding
    Hardcover
    Edition number
    1
    Number of pages
    120