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Synopsis
By Avram Bar-Cohen and Allan D. Kraus The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.
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Advances in Thermal Modeling of Electronic Components and Systems. Volume 1
Published by
Hemisphere Publishing Company, 1988
ISBN 10: 0891166890
ISBN 13: 9780891166894
Used
Hardcover
Seller: Meadowland Media, Fayetteville, AR, U.S.A.
Seller rating 4 out of 5 stars
hardcover. Ships same or next business day. Seller Inventory # B111-040126-S-106