Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science - Hardcover
Synopsis
Hardcover Book - Wire Bonding in Microelectronics ISBN # 0-930815-25-4
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: Wonder Book, Frederick, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: Very Good. Very Good condition. A copy that may have a few cosmetic defects. May also contain light spine creasing or a few markings such as an owner's name, short gifter's inscription or light stamp. Seller Inventory # U09B-05303
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Reliability and Yield Problems of Wire Bonding in Microelectronics : The Application of Materials and Interface Science
Published by
International Society for Hybrid Microelectronics, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
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Hardcover
Seller: Better World Books: West, Reno, NV, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Seller Inventory # 10163251-75
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Reliability and Yield Problems of Wire Bonding in Microelectronics : The Application of Materials and Interface Science
Published by
International Society for Hybrid Microelectronics, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
Used
Hardcover
Seller: Better World Books, Mishawaka, IN, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Seller Inventory # 5475174-6
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: HPB-Red, Dallas, TX, U.S.A.
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Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_322936498
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Published by
Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
Used
Hardcover
Seller: Bingo Books 2, Vancouver, WA, U.S.A.
Seller rating 4 out of 5 stars
Hardcover. Condition: Fine. hardback book in fine condition. Seller Inventory # 123284
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Published by
Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
Used
Hardcover
Seller: Bingo Books 2, Vancouver, WA, U.S.A.
Seller rating 4 out of 5 stars
Hardcover. Condition: Fine. hardback book in fine condition. Seller Inventory # 122444
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.
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Hardcover. Condition: New. In shrink wrap. Looks like an interesting title! Seller Inventory # Q-0930815254