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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science - Hardcover
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Hardcover Book - Wire Bonding in Microelectronics ISBN # 0-930815-25-4
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: Wonder Book, Frederick, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: Very Good. Very Good condition. A copy that may have a few cosmetic defects. May also contain light spine creasing or a few markings such as an owner's name, short gifter's inscription or light stamp. Seller Inventory # U09B-05303
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Reliability and Yield Problems of Wire Bonding in Microelectronics : The Application of Materials and Interface Science
Published by
International Society for Hybrid Microelectronics, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
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Hardcover
Seller: Better World Books, Mishawaka, IN, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Seller Inventory # 5475174-6
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. Seller Inventory # G0930815254I3N00
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: HPB-Red, Dallas, TX, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_322936498
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: HPB-Emerald, Dallas, TX, U.S.A.
Seller rating 5 out of 5 stars
hardcover. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_483203801
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Published by
Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
Used
Hardcover
Seller: Bingo Books 2, Vancouver, WA, U.S.A.
Seller rating 4 out of 5 stars
Hardcover. Condition: Fine. hardback book in fine condition. Seller Inventory # 123284
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Published by
Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
Used
Hardcover
Seller: Bingo Books 2, Vancouver, WA, U.S.A.
Seller rating 4 out of 5 stars
Hardcover. Condition: Fine. hardback book in fine condition. Seller Inventory # 122444
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1989 HC Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: Miki Store, San Jose, CA, U.S.A.
Seller rating 5 out of 5 stars
hardcover. Condition: Very Good. Dust Jacket Condition: DUST JACKET. Pages are crisp and clean, no marking. Cover is verygood. Binding is tight/good. Seller Inventory # hb-bs23
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: New. In shrink wrap. Looks like an interesting title! Seller Inventory # Q-0930815254