Wireless Interface Technologies for 3D IC and Module Integration - Hardcover

Kuroda, Tadahiro; Yip, Wai-Yeung

Hardcover

ISBN 10: 110884121X ISBN 13: 9781108841214

Publisher: Cambridge University Press, 2021

Synopsis

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

About this title

About the Authors

Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE.

Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.

Edition details

• Publisher: Cambridge University Press
• Publication date: 2021
• Language: English
• ISBN 10: 110884121X
• ISBN 13: 9781108841214
• Binding: Hardcover
• Edition number: 1
• Number of pages: 300