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Synopsis
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.
The book focuses on an important step in semiconductor manufacturing―package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.
By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
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About the Author
Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.
Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.
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Semiconductor Packaging
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Condition: Good. : En la fabricación de semiconductores, es fundamental comprender cómo se comportan e interactúan los diversos materiales para crear un paquete de semiconductores robusto y confiable. 'Semiconductor Packaging: Materials Interaction and Reliability' proporciona una comprensión fundamental de las propiedades físicas subyacentes de los materiales utilizados en un paquete de semiconductores. El libro se centra en un paso importante en el ensamblaje y las pruebas de paquetes de fabricación de semiconductores. Cubre los conceptos básicos de las propiedades de los materiales y explica cómo determinar qué comportamientos son importantes para el rendimiento del paquete. Los autores también analizan cómo las propiedades de los materiales de embalaje interactúan entre sí y exploran cómo maximizar el rendimiento de estos materiales con respecto a la integridad y la confiabilidad del paquete. Al unir los elementos dispares esenciales para un paquete de semiconductores, este libro de fácil lectura muestra cómo todas las partes encajan y funcionan juntas para brindar una protección duradera para el chip de circuito integrado en el interior, así como un medio para que el chip se comunique con el mundo exterior. EAN: 9781138075405 Tipo: Libros Categoría: Tecnología Título: Semiconductor Packaging Autor: Andrea Chen Idioma: en Páginas: 216 Formato: tapa dura. Seller Inventory # Happ-2026-07-03-50337550
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Semiconductor Packaging : Materials Interaction and Reliability
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Semiconductor Packaging : Materials Interaction and Reliability
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Semiconductor Packaging: Materials Interaction and Reliability
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Semiconductor Packaging : Materials Interaction and Reliability
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Semiconductor Packaging: Materials Interaction and Reliability
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Semiconductor Packaging: Materials Interaction and Reliability
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Taylor & Francis Ltd, 2017
ISBN 10: 113807540X
ISBN 13: 9781138075405
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Semiconductor Packaging
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Seller Inventory # L0-9781138075405
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Semiconductor Packaging : Materials Interaction and Reliability
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