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Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.
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- PublisherMaterials Research Society
- Publication date1998
- ISBN 10 1558994211
- ISBN 13 9781558994218
- BindingHardcover
- Edition number1
- Number of pages262
- EditorBelton Daniel J., Gaynes Michael, Jacobs Elizabeth G., Pearson Raymond, Wu Tien
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Electronic Packaging Materials Science X: Symposium held April 14-16, 1998, San Francisco, California, U.S.A.
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Materials Research Society
(1998)
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Book Description gebundene Ausgabe. Condition: Gut. 262 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; im oberen Abschnitt leicht wasserwellig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 620. Seller Inventory # 1586344
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Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A. Materials Research Society symposia proceedings, Vol. 515.
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Warrendale, Pennsylvania. : Materials Research Society
(1998)
ISBN 10: 1558994211
ISBN 13: 9781558994218
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Book Description 262 p. Ex-Library Book in good condition. 9781558994218 Sprache: Englisch Gewicht in Gramm: 800. Seller Inventory # 1473455
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Electronic Packaging Materials Science X: Volume 515 (MRS Proceedings)
Published by
Materials Research Society
(1998)
ISBN 10: 1558994211
ISBN 13: 9781558994218
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Hardcover
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Book Description hardcover. Condition: Good. Good. book. Seller Inventory # D8S0-3-M-1558994211-3
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Electronic Packging Mats Sci X V515 Hb
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Book Description Condition: Muy Bueno / Very Good. Seller Inventory # 100000000079724
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