This authoritative new resource presents practical techniques for optimizing RF and microwave circuits for applications in radar systems design with an emphasis on current and emerging technologies. Professionals learn how to design RF components for radar systems and how to choose appropriate materials and packaging methods. This book explains how to integrate components while avoiding higher-level assembly issues and troubleshooting problems on the measurement bench. Theory and practical information are provided while addressing topics ranging from heat removal to digital circuit integration.
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Nickolas Kingsley leads the RF Front-end and Converter Capability Group at BAE Systems in Nashua, NH. Previously he was the Director of Engineering at Auriga Microwave. He received his Ph.D. in electrical engineering from Georgia Institute of Technology.Joseph R. Guerci is the president and CEO of Information Systems Laboratories, Inc. He received his Ph.D. in electrical engineering from NYU Polytechnic University.
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Hardback. Condition: Good. This authoritative new resource presents practical techniques for optimizing RF and microwave circuits for applications in radar systems design with an emphasis on current and emerging technologies. Professionals learn how to design RF components for radar systems and how to choose appropriate materials and packaging methods. This book explains how to integrate components while avoiding higher-level assembly issues and troubleshooting problems on the measurement bench. Theory and practical information are provided while addressing topics ranging from heat removal to digital circuit integration. Seller Inventory # 00085941903
Seller: World of Books Inc, Montgomery, IL, U.S.A.
Hardback. Condition: Good. This authoritative new resource presents practical techniques for optimizing RF and microwave circuits for applications in radar systems design with an emphasis on current and emerging technologies. Professionals learn how to design RF components for radar systems and how to choose appropriate materials and packaging methods. This book explains how to integrate components while avoiding higher-level assembly issues and troubleshooting problems on the measurement bench. Theory and practical information are provided while addressing topics ranging from heat removal to digital circuit integration. Seller Inventory # CIN1608079708G
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