Earlier Research studies on heat transfer enhancement have gained serious momentum during recent years and have been proposed many techniques using different fluid. Conventional heat transfer fluids have inherently low thermal conductivity that greatly limits the heat exchange efficiency. Moreover, the cooling capacity of conventional heat transfer fluids and redesigning of heat exchangers have reached their limitations. A novel fluid with higher thermal conductivity has been developed to overcome these problems. The dispersion of 1-100nm sized solid nanoparticles in the traditional heat transfer fluids, termed as nanofluids, exhibit substantial higher convective heat transfer than that of traditional heat transfer fluids. In this experimental investigation, the heat transfer enhancement in plate heat exchanger using SiO2 and CuO / water nanofluids are taken together to study the heat transfer and pressure drop. The SiO2 and CuO / water nanofluid 0.1%, 0.2% particle volume concentration has been prepared by using two step method by Stirrer and Ultra Sonicator apparatus. The dry SiO2 and CuO nanoparticles and dispersed SiO2 and CuO nanoparticles in distilled water have been characterized by using sonicator. Stirrer was mixing of nanoparticles and base fluid (water). It is found that the average particle size is between 10-20 nm and the particles are uniformly dispersed in distilled water. The experimental set up has been designed and tests have been carried out by flowing 0.1% and 0.2% volume concentration of SiO2/water and CuO/water nanofluids in Plate Heat exchanger and flow rate was 30,50,70,100 lpm. These experiments have been done under the plate heat exchanger laminar flow conditions. It is found that the experimental in plate heat exchanger Nusselt number, Overall Heat Transfer Coefficient and heat transfer coefficients increases with increasing particle volume concentration and flow rate in both laminar and turbulent flow. The enhancement of the experimental in Overall heat Transfer coefficient is found to be 40% of CuO nanofluid is higher than water in laminar flow condition
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