Design of Terahertz CMOS Integrated Circuits for High-Speed Wireless Communication (Materials, Circuits and Devices) - Hardcover

Fujishima, Minoru; Amakawa, Shuhei

Hardcover

ISBN 10: 1785613871 ISBN 13: 9781785613876

Publisher: The Institution of Engineering and Technology, 2019

Synopsis

Communications technology at a frequency range into Terahertz (THz) levels has attracted attention because it promises near-fibre-optic-speed wireless links for the 5G and post-5G world. Transmitter and receiver integrated circuits based on CMOS, which has the ability to realize such circuits with low power consumption at a low cost, are expected to become increasingly widespread, with much research into the underlying electronics currently underway.

This book describes recent research on terahertz CMOS design for high-speed wireless communication. The topics covered include fundamental technologies for terahertz CMOS design, amplifier design, physical design approaches, transceiver design, and future prospects. This concise source of key information, written by leading experts in the field, is intended for researchers and professional circuit designers working in RFIC and CMOS design for telecommunications.

About this title

About the Author:

Minoru Fujishima is a professor of the Graduate School of Advanced Sciences of Matter, Hiroshima University, where his current research interests are in the designs of low-power millimeter- and short-millimeter-wave wireless CMOS circuits. He co-authored more than 40 journal papers and 100 conference papers, and one book.

Shuhei Amakawa is an associate professor at the Graduate School of Advanced Sciences of Matter, Hiroshima University, where his research interests include modelling and simulation of nanoelectronic devices and systems, design of RF circuits and interconnects, and microwave theory and measurement.

About this edition

• Publisher: The Institution of Engineering and Technology
• Publication date: 2019
• ISBN 10: 1785613871
• ISBN 13: 9781785613876
• Binding: Hardcover
• Number of pages: 200