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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials) - Hardcover
Book 88 of 203: Woodhead Publishing Series in Electronic and Optical Materials
Synopsis
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
- Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
- Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
- Includes program files and macros for additional study
"synopsis" may belong to another edition of this title.
About the Author
Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia
"About this title" may belong to another edition of this title.
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Elsevier Science Mai 2015, 2015
ISBN 10: 1845695283
ISBN 13: 9781845695286
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. 482 pp. Englisch. Seller Inventory # 9781845695286
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Seller Inventory # 9781845695286
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