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Coating Materials for Electronic Applications: Polymers, Processes, Reliability, Testing - Hardcover
Synopsis
Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits. There is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings. Finally, the author discusses regulations of OSHA, EPA, and other government agencies which have resulted in formulation changes to meet VOC and toxicity requirements.
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From the Back Cover
James J. Licari is President of AvanTeco, Whittier, CA and a consultant on materials and processes for microelectronics. Prior to this, he was Chief Scientist for Hughes’ Microelectronics Division in Newport Beach, CA, where he led the development of high-density, high-performance multichip modules for high reliability military and space applications. Dr. Licari is internationally recognized for his contributions to the microelectronics field, particularly in the development of materials and processes for interconnecting and packaging hybrid microcircuits and multichip modules. At Rockwell’s Autonetics Division he served as Manager of the Interconnect Systems Laboratories for 28 years. He is the recipient of six NASA awards, the annual Technical Achievement Award from IMAPS, and the Materials Engineer of the Year Award from NEPCON. Licari is also the author of four books and over 100 publications and has lectured at UCLA, Jet Propulsion Laboratories, and Oxford University, among others.
About the Author
has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes.
Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators, J. Polymer Chemistry (1999)
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- PublisherSpringer-Verlag Berlin and Heidelberg GmbH & Co. KG
- Publication date2003
- ISBN 10 354040869X
- ISBN 13 9783540408697
- BindingHardcover
- LanguageEnglish
- Edition number1
- Number of pages531
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