Synopsis
Microprocessor has become the heart of home/office PC systems. The microprocessor device require electrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of a microprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are various parameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and fin shape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. If copper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heat sink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sink performed better. However, there are space limitations for every heat sink in a computer. Also the increase in number of fin was not a solution for improving heat transfer. So the fin shape is the parameter which has been studied in this work for better results.
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About the Author
Bachelor of Engineering (Mechanical Engineering)Master of Engineering (General Mechanical)Currently Working as a Assistant Professorin Dept. of Mechanical Engineering.(R.C.Patel Institute of technology, Shirpur Maharashtra)Four Papers published,Two conferences,Ten Workshops.Total 6 Years academic experience & 1 year industrial experience.
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Proficient Fin Shape for Microprocessor Cooling
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LAP Lambert Academic Publishing Jan 2017, 2017
ISBN 10: 3659873659
ISBN 13: 9783659873652
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Microprocessor has become the heart of home/office PC systems. The microprocessor device require electrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of a microprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are various parameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and fin shape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. If copper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heat sink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sink performed better. However, there are space limitations for every heat sink in a computer. Also the increase in number of fin was not a solution for improving heat transfer. So the fin shape is the parameter which has been studied in this work for better results. 68 pp. Englisch. Seller Inventory # 9783659873652
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Proficient Fin Shape for Microprocessor Cooling
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Proficient Fin Shape for Microprocessor Cooling
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Baviskar PankajBachelor of Engineering (Mechanical Engineering)Master of Engineering (General Mechanical)Currently Working as a Assistant Professorin Dept. of Mechanical Engineering.(R.C.Patel Institute of technology, Shirpur Maharas. Seller Inventory # 158248527
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Proficient Fin Shape for Microprocessor Cooling
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ISBN 10: 3659873659
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Microprocessor has become the heart of home/office PC systems. The microprocessor device require electrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of a microprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are various parameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and fin shape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. If copper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heat sink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sink performed better. However, there are space limitations for every heat sink in a computer. Also the increase in number of fin was not a solution for improving heat transfer. So the fin shape is the parameter which has been studied in this work for better results.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 68 pp. Englisch. Seller Inventory # 9783659873652
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Proficient Fin Shape for Microprocessor Cooling
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ISBN 10: 3659873659
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Microprocessor has become the heart of home/office PC systems. The microprocessor device require electrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of a microprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are various parameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and fin shape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. If copper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heat sink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sink performed better. However, there are space limitations for every heat sink in a computer. Also the increase in number of fin was not a solution for improving heat transfer. So the fin shape is the parameter which has been studied in this work for better results. Seller Inventory # 9783659873652
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Proficient Fin Shape for Microprocessor Cooling
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ISBN 10: 3659873659
ISBN 13: 9783659873652
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Taschenbuch. Condition: Neu. Proficient Fin Shape for Microprocessor Cooling | Pankaj Baviskar (u. a.) | Taschenbuch | 68 S. | Englisch | 2017 | LAP LAMBERT Academic Publishing | EAN 9783659873652 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. Seller Inventory # 108204672
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