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Synopsis
Lead is banned in alloy making processes due to its inherent toxicity. Therefore lead cannot be used in solder making. Lead was used in the solder alloy making process for more than 2000 years. This leads to a need of lead free solder alloys which can replace the old Sn-Pb alloy. Not only the ban of lead, need for solder alloys which can be used in dense electronic assemblies with less pitch, need of high temperature solder alloys and the environmental tag also lead to the search for new solder alloys. Sn-Ag-Cu were discovered and is very popular. The more percentage of Ag in the alloy will add cost to the alloy. Then the researchers were searching for new low cost alloys. This book reviews the important lead free solder alloys and processes using in the present scenario which can replace Sn-Pb.
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- PublisherLAP LAMBERT Academic Publishing
- Publication date2019
- ISBN 10 6200287511
- ISBN 13 9786200287519
- BindingPaperback
- LanguageEnglish
- Number of pages52
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A study on Lead free solder alloy
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LAP LAMBERT Academic Publishing Aug 2019, 2019
ISBN 10: 6200287511
ISBN 13: 9786200287519
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Lead is banned in alloy making processes due to its inherent toxicity. Therefore lead cannot be used in solder making. Lead was used in the solder alloy making process for more than 2000 years. This leads to a need of lead free solder alloys which can replace the old Sn-Pb alloy. Not only the ban of lead, need for solder alloys which can be used in dense electronic assemblies with less pitch, need of high temperature solder alloys and the environmental tag also lead to the search for new solder alloys. Sn-Ag-Cu were discovered and is very popular. The more percentage of Ag in the alloy will add cost to the alloy. Then the researchers were searching for new low cost alloys. This book reviews the important lead free solder alloys and processes using in the present scenario which can replace Sn-Pb. 52 pp. Englisch. Seller Inventory # 9786200287519
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A study on Lead free solder alloy
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LAP LAMBERT Academic Publishing, 2019
ISBN 10: 6200287511
ISBN 13: 9786200287519
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A study on Lead free solder alloy
Published by
LAP LAMBERT Academic Publishing, 2019
ISBN 10: 6200287511
ISBN 13: 9786200287519
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Lead is banned in alloy making processes due to its inherent toxicity. Therefore lead cannot be used in solder making. Lead was used in the solder alloy making process for more than 2000 years. This leads to a need of lead free solder alloys which can replace the old Sn-Pb alloy. Not only the ban of lead, need for solder alloys which can be used in dense electronic assemblies with less pitch, need of high temperature solder alloys and the environmental tag also lead to the search for new solder alloys. Sn-Ag-Cu were discovered and is very popular. The more percentage of Ag in the alloy will add cost to the alloy. Then the researchers were searching for new low cost alloys. This book reviews the important lead free solder alloys and processes using in the present scenario which can replace Sn-Pb. Seller Inventory # 9786200287519
Quantity: 1 available
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A study on Lead free solder alloy
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ISBN 10: 6200287511
ISBN 13: 9786200287519
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A study on Lead free solder alloy
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A study on Lead free solder alloy
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ISBN 10: 6200287511
ISBN 13: 9786200287519
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: s JayeshMr. Jayesh S is working as Assistant professor at School of Engineering, CUSAT, Kerala. He is a post graduate from PSG College of technology, Coimbatore in the area of product Design. He graduated in Mechanical Engineering fr. Seller Inventory # 385887343
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