Items related to Information Science and Technology Academic Works Series:...
Information Science and Technology Academic Works Series: Integrated Circuit 3D System Integration and Packaging Process (Chinese Guide)(Chinese Edition) - Softcover
Search results for Information Science and Technology Academic Works Series:...
Seller Image
Information Science and Technology academic Works series: integrated circuit three-dimensional system integration and packaging Technology (Chinese guide)(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Paperback. Pub Date: 2017-03-01 Pages: $number Language: Chinese Publisher: Science Press. Journal of Information Science and technology: integrated circuit three-dimensional system integration and encapsulation Technology (Chinese Guide) system discussion for electronic. 2 of optoelectronic and MEMS devices. 5D. 3D. and 3D IC integration and packaging technology . Seller Inventory # DP052518
Buy New
US$ 216.50
US$ 18.00 shipping
Ships from China to U.S.A.
Ships from China to U.S.A.
Quantity: 3 available