Synopsis
This book includes: the specification of optoelectronic device package; process of expanding crystal; mounted process; lead soldering processes; device packaging technology; product testing and packaging and its six projects; and also give detailed description of optoelectronic device packaging process and technical requirements.
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Semiconductor optoelectronic device packaging process (with DVD disc 1)(Chinese Edition)
Published by
Publishing House of Electronics Industry, 1905
ISBN 10: 712112887X
ISBN 13: 9787121128875
New
paperback
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto. Seller Inventory # CC008597