计算机组装与维修 学习指导与练习(第3版) 于景辉 主编 - Softcover

 
9787121284472: 计算机组装与维修 学习指导与练习(第3版) 于景辉 主编

Synopsis

moldsize:L8.8xW5.7xH3cm(L3.46xW2.24xH1.2inch)
mold weight:103g
Usage: It be used for doing all kinds of beautiful candle and cake decoration. Feature: high temperature resisting,easy to clean,long lifetime

"synopsis" may belong to another edition of this title.