Items related to 摩尔时代电子封...
摩尔时代电子封装建模分析设计与测试 Modeling,Analysis,Design and Tests for Electronics Packaging beyond Moore 电子封装书 - Hardcover
Synopsis
Industry Industry Press This book systematically introduces the theoretical model. analysis and new simulation results of advanced packaging in the ultra-molecular era. The content in...
"synopsis" may belong to another edition of this title.
Search results for 摩尔时代电子封...
Stock Image
Modeling. Analysis. Design and Tests for Electronics Packaging beyond Moore(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
Hardcover. Condition: New. HardCover.Pub Date:2021-03-01 Pages:420 Language:English Publisher:Chemical Industry Press This book systematically introduces the theoretical model. analysis and new simulation results of advanced packaging in the ultra-molecular era. The content involves the electrical properties. thermal properties. thermomechanical properties. heat dissipation issues. reliability issues. electrical crosstalk of 2.5D. 3D. wafer-level packaging. etc. A modeling method based on the volume average theory of p. Seller Inventory # NX046096
Buy New
US$ 406.83
US$ 18.00 shipping
Ships from China to U.S.A.
Ships from China to U.S.A.
Quantity: 1 available