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Industry Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and ...
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Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and . Seller Inventory # AMZ012358_NX046087_012358
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US$ 498.50
US$ 18.00 shipping
Ships from China to U.S.A.
Ships from China to U.S.A.
Quantity: 3 available
Stock Image
Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
Hardcover. Condition: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and . Seller Inventory # NX046087
Buy New
US$ 498.50
US$ 18.00 shipping
Ships from China to U.S.A.
Ships from China to U.S.A.
Quantity: 1 available