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TMS320C55x DSP Application Design (3rd Edition) five universities planning materials(Chinese Edition) - Softcover
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正版授权 Seller : Bonrise加微信[soweinc]每天分享好书,邀你加入国际微信群学习交流.微信好友低至5-9折的优惠 .书名:TMS320C55x DSP应用系统设计（第3版）简介:作者:赵洪亮 等编著出版社:北京航空航天大学出版社出版时间:2014年03月装订方式:平装分类:教材|研究生/本科/专科教材|工学图书|计算机/网络|网络与数据通信|通信
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TMS320C55x DSP Application Design (3rd Edition) five universities planning materials(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Paperback. Pub Date :2014-03-01 Pages: 403 Language: Chinese Publisher: Beijing University of Aeronautics and Astronautics Press TMS320C55x DSP Application Design (3rd Edition) five universities planning materials. TI's TMS320C55x series chips as an object. a systematic introduction to the basics of design methods developed DSP chip and DSP applications. The book is divided into 10 chapters. the main contents are: C55x hardware architecture and instruction; using assembly language. CC + + lan. Seller Inventory # BX067383