Language:Chinese,binding:No Binding,publisher:Southeast University Pub. Date :2007-07-01 version 1, description:Pages Number: 365 Publisher: Southeast University Pub. Date :2007-07-01 version 1. In accordance with the teaching materials and device physics, manufacturing processes, layout design, components and SPICE models, SPICE-based circuit sim...
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paperback. Condition: New. Paperback. Pub Date: 2007 07 Pages: 365 Publisher: Southeast University Press textbook in accordance with the materials and device physics. manufacturing process. layout design. components and its SPICE model. SPICE-based integrated circuit simulation. transistor-level design. bottom-up design process of the module-level design. system-level design. IC packaging and testing about the basics of integrated circuit design and basic technology. and describes the nine days (Zeni) system. Silvaco s. Seller Inventory # CB072818
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