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Particle Adhesion: Applications and Advances - Hardcover

 
9789056997250: Particle Adhesion: Applications and Advances
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Whenever a curved surface interacts with another surface, the principles of adhesion are at work. From the cells in your body to the dust on your glasses, intermolecular forces cause materials to attract one another. Elastic deformations resulting from these adhesive interactions store strain that can be liberated during particle detachment. Time dependent changes in adhesion can result from plastic deformation that both increases the real effective contact area and reduces the stored energy available to assist in particle removal. Processes such as these, based on the fundamentals tenets of particle adhesion, are now finding applications across many disciplines leading to a rich and rapid development of knowledge.

This book documents the use of particle adhesion concepts in a variety of disciplines. Fields as varied as the cleaning of semiconductors, to the controlling of cancer metastasis, to the abatement of environmental pollution all benefit from applications of particle adhesion concepts.

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About the Author:
David J. Quesnel holds a Bachelor of Engineering from the State University of New York at Stony Brook and a MS and PhD from Northwestern University. Dr. Quesnel is currently Professor of Mechanical Engineering and Professor of Materials Science at the University of Rochester and is a registered Professional Engineer. His research centers on the Physics controlling mechanical properties of materials with recent emphasis on particulate materials, cohesive powders and adhesion. He has authored more than 75 technical papers and holds 3 patents.
Ronald S. Rimai received his BS (physics) from Rensselaer Polytechnic Institute and his MS and PhD (physics) from the University of Chicago and is presently a principal scientist at NexPress Solutions LLC. Dr. Rimai conducts research in the areas of particle adhesion and electrophotography. He has written more than 100 papers and holds 50 patents. He has won the Society of Imaging Science and Technology's Charles Ives award for engineering excellence, was Eastman Kodak Distinguished Inventor and is a fellow of the APS and the Adhesion Society.
Louis H. Sharpe earned a BS from Virginia Polytechnic Institute and a PhD from Michigan State University, both in chemistry. Dr. Sharpe retied after 30 years at AT&T Bell Laboratories where he supervised groups in applied surface chemistry and in adhesives engineering and development. He is entering his 33rd year as founding Editor in Chief of the Journal of Adhesion. He has won the ASTM Adhesives Award, and the ASTM Award of Merit as well as the The Adhesion Society Award for Excellence in Adhesion Science, and is a Fellow of the Adhesion Society and ASTM. He was the first William C. Wake Memorial Lecturer of the Plastics and Rubber Institute of Great Britain.

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Quesnel, David J. (EDT); Rimai, Donald S. (EDT); Sharpe, Louis H. (EDT); Adhesion Society Meeting 1999 (Panama Beach, Fla.) (COR); Adhesion Society Meeting 1999 (Las Vegas, Nev.) (COR)
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Quesnel, David J. (EDT); Rimai, Donald S. (EDT); Sharpe, Louis H. (EDT); Adhesion Society Meeting 1999 (Panama Beach, Fla.) (COR); Adhesion Society Meeting 1999 (Las Vegas, Nev.) (COR)
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Quesnel, David J. (Editor)/ Rimai, Donald S. (Editor)/ Sharpe, Louis H. (Editor)/ Adhesion Society Meeting 1999 (Panama Beach, Fla.)/ Adhesion Society Meeting 1999 (Las Vegas, Nev.)
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