Items related to ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS (Emerging...

ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS (Emerging Techn in Circuits & Systems) - Hardcover

Yu, Ntu Singapore Hao; Tan, Ntu Singapore Chuan-Seng

 
9789814699006: ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS (Emerging Techn in Circuits & Systems)
Hardcover
ISBN 10: 9814699004 ISBN 13: 9789814699006
Publisher: World Scientific Pub Co Inc, 2015

Synopsis

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

"synopsis" may belong to another edition of this title.

From the Back Cover

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

"About this title" may belong to another edition of this title.

Publisher
World Scientific Pub Co Inc
Publication date
2015
Language
English
ISBN 10 
9814699004
ISBN 13 
9789814699006
Binding
Hardcover
Number of pages
392