Adhesion in Microelectronics

K L Mittal

ISBN 10: 1118831330 / ISBN 13: 9781118831335

Published by Wiley Sep 2014, 2014

About this Item

Neuware - This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;\* Various theories or mechanisms of adhesion\* Surface (physical or chemical) characterization of materials as it pertains to adhesion\* Surface cleaning as it pertains to adhesion\* Ways to improve adhesion\* Unraveling of interfacial interactions using an array of pertinent techniques\* Characterization of interfaces / interphases\* Polymer-polymer adhesion\* Metal-polymer adhesion (metallized polymers)\* Polymer adhesion to various substrates\* Adhesion of thin films\* Adhesion of underfills\* Adhesion of molding compounds\* Adhesion of different dielectric materials\* Delamination and reliability issues in packaged devices\* Interface mechanics and crack propagation\* Adhesion measurement of thin films and coatings.

Seller Inventory # 9781118831335

Bibliographic Details

• Title: Adhesion in Microelectronics
• Publisher: Wiley Sep 2014
• Publication Date: 2014
• Language: English
• ISBN 10: 1118831330
• ISBN 13: 9781118831335
• Binding: Buch
• Condition: Neu
• Dimensions: 236W x 155H x 25D millimeters 236 millimeters width by 155 millimeters height by 25 millimeters depth
• Weight: 635 grams

About this title

Synopsis

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

• Various theories or mechanisms of adhesion
• Surface (physical or chemical) characterization of materials as it pertains to adhesion
• Surface cleaning as it pertains to adhesion
• Ways to improve adhesion
• Unraveling of interfacial interactions using an array of pertinent techniques
• Characterization of interfaces / interphases
• Polymer-polymer adhesion
• Metal-polymer adhesion  (metallized polymers)
• Polymer adhesion to various substrates
• Adhesion of thin films
• Adhesion of underfills
• Adhesion of molding compounds
• Adhesion of different dielectric materials
• Delamination and reliability issues in packaged devices
• Interface mechanics and crack propagation
• Adhesion measurement of thin films and coatings

About the Author

Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Sk?odowska University, Lublin, Poland. He is the editor of more than 110 volumes dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.

Tanweer Ahsan is a scientist engineer at Henkel Electronic Materials LLC in Irvine, California.