Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)

LIU SHENG . LIU YONG

Language: English

Published by Chemical Industry Press, 2021

7122392279 / 9787122392275

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HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .

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Title
Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)
Author
LIU SHENG . LIU YONG
Publisher
Chemical Industry Press
Publication year
2021
Condition
New
Binding
Hardcover
Language
English
ISBN 10
7122392279
ISBN 13
9787122392275

liu xing

Nanjing, JS, China

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