Advanced Flip Chip Packaging

Language: English

Published by Springer US Mrz 2013, 2013

1441957677 / 9781441957672

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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Item description from seller

This item is printed on demand - it takes 3-4 days longer - Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. 568 pp. Englisch.

Seller Inventory # 9781441957672

Title
Advanced Flip Chip Packaging
Author
Ho-Ming Tong
Publisher
Springer US Mrz 2013
Publication year
2013
Condition
Neu
Binding
Buch
Language
English
ISBN 10
1441957677
ISBN 13
9781441957672
Item weight
1,010 grams
Dimensions
241x160x36 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
First itemUS$ 26.66US$ 26.66
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BuchWeltWeit Ludwig Meier e.K.

Germany