Advanced Flip Chip Packaging

Ho-Ming Tong

ISBN 10: 1489979336 / ISBN 13: 9781489979339

Published by Springer US Aug 2016, 2016

About this Item

This item is printed on demand - it takes 3-4 days longer - Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. 568 pp. Englisch.

Seller Inventory # 9781489979339

Bibliographic Details

• Title: Advanced Flip Chip Packaging
• Publisher: Springer US Aug 2016
• Publication Date: 2016
• Language: English
• ISBN 10: 1489979336
• ISBN 13: 9781489979339
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 235W x 155H x 29D millimeters 235 millimeters width by 155 millimeters height by 29 millimeters depth
• Weight: 953 grams

About this title

Synopsis

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

From the Back Cover

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

This book also:

• Offers broad-ranging chapters with a focus on IC-package-system integration
• Provides viewpoints from leading industry executives and experts
• Details state-of-the-art achievements in process technologies and scientific research
• Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information

Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.