Advanced Flip Chip Packaging

Language: English

Published by Springer US Aug 2016, 2016

1489979336 / 9781489979339

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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Softcover

Condition: New

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Item description from seller

This item is printed on demand - it takes 3-4 days longer - Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. 568 pp. Englisch.

Seller Inventory # 9781489979339

Title
Advanced Flip Chip Packaging
Author
Ho-Ming Tong
Publisher
Springer US Aug 2016
Publication year
2016
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
1489979336
ISBN 13
9781489979339
Item weight
953 grams
Dimensions
235x155x29 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
First itemUS$ 25.76US$ 25.76
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BuchWeltWeit Ludwig Meier e.K.

Germany