Advanced Flip Chip Packaging

Ho-Ming Tong

ISBN 10: 1441957677 / ISBN 13: 9781441957672

Published by Springer US, Springer New York Mär 2013, 2013

About this Item

This item is printed on demand - Print on Demand Titel. Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 568 pp. Englisch.

Seller Inventory # 9781441957672

Bibliographic Details

• Title: Advanced Flip Chip Packaging
• Publisher: Springer US, Springer New York Mär 2013
• Publication Date: 2013
• Language: English
• ISBN 10: 1441957677
• ISBN 13: 9781441957672
• Binding: Buch
• Condition: Neu
• Dimensions: 241W x 160H x 36D millimeters 241 millimeters width by 160 millimeters height by 36 millimeters depth
• Weight: 1010 grams

About this title

Synopsis

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

From the Back Cover

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

This book also:

• Offers broad-ranging chapters with a focus on IC-package-system integration
• Provides viewpoints from leading industry executives and experts
• Details state-of-the-art achievements in process technologies and scientific research
• Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information

Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.