Advanced Flip Chip Packaging
Language: English
Published by Springer 2013-03-21, 2013
- Hardcover
- New
Seller: Chiron Media, Wallingford, United KingdomChiron Media
AbeBooks seller since August 2, 2010
Condition: New
US$ 287.21
Quantity: 1 available
Add to basketItem description from seller
Brand new book, sourced directly from publisher. Dispatch time is 24-48 hours from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.
Seller Inventory # 6666-GRD-9781441957672
- Title
- Advanced Flip Chip Packaging
- Author
- Ho-Ming Tong, Yi-Shao Lai, C. P. Wong
- Publisher
- Springer 2013-03-21
- Publication year
- 2013
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 1441957677
- ISBN 13
- 9781441957672
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
"Synopsis" may belong to another edition of this title.
From the Back Cover
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
This book also:
- Offers broad-ranging chapters with a focus on IC-package-system integration
- Provides viewpoints from leading industry executives and experts
- Details state-of-the-art achievements in process technologies and scientific research
- Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information
Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
"About the title" may belong to another edition of this title.
Chiron Media
Wallingford, United Kingdom
AbeBooks seller since August 2, 2010
Shipping rates from United Kingdom to U.S.A.
| Item | 19 to 33 business days | 19 to 33 business days |
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