Advanced Flip Chip Packaging
Language: English
Published by Springer Verlag, 2013
- Hardcover
- New
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
AbeBooks seller since January 6, 2003
Condition: New
US$ 358.89
Quantity: 2 available
Add to basketItem description from seller
2013 edition. 567 pages. 9.25x6.50x1.25 inches. In Stock.
Seller Inventory # x-1441957677
- Title
- Advanced Flip Chip Packaging
- Author
- Tong, Ho-Ming (Editor)
- Publisher
- Springer Verlag
- Publication year
- 2013
- Condition
- Brand New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 1441957677
- ISBN 13
- 9781441957672
- Item weight
- 1.23 kilograms
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
"Synopsis" may belong to another edition of this title.
From the Back Cover
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
This book also:
- Offers broad-ranging chapters with a focus on IC-package-system integration
- Provides viewpoints from leading industry executives and experts
- Details state-of-the-art achievements in process technologies and scientific research
- Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information
Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
"About the title" may belong to another edition of this title.
Revaluation Books
Exeter, United Kingdom
AbeBooks seller since January 6, 2003
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Edward Bowditch Ltd
Exstowe, Exton
Exeter, United Kingdom EX3 0PP
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Legal entity name: Edward Bowditch Ltd
Legal entity form: Limited company
Business correspondence address: Exstowe, Exton, Exeter, EX3 0PP
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Authorised representative: Mr. E. Bowditch
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