Advanced Interconnect and Packaging

Language: English

Published by MDPI AG, 2023

303656733X / 9783036567334

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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nach der Bestellung gedruckt Neuware - Printed after ordering - Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement 'More-than-Moore' technologies, providing heterogeneous materials and technologies on a single chip. The 'Advanced Interconnect and Packaging' Special Issue seeks to showcase research papers on new developments in advanced interconnect and packaging, i.e., on the design, modeling, fabrication, and reliability assessment of emerging interconnect and packaging technologies. Additionally, there are two interesting papers on carbon nanotube interconnects and interconnect reliability issues. …

Seller Inventory # 9783036567334

Title
Advanced Interconnect and Packaging
Publisher
MDPI AG
Publication year
2023
Condition
Neu
Binding
Buch
Language
English
ISBN 10
303656733X
ISBN 13
9783036567334
Item weight
865 grams
Dimensions
250x175x22 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

Item7 to 10 business days5 to 7 business days
First itemUS$ 39.38US$ 50.64
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